Description

• Fab 1 - 16K, 6"wafers per month 0.35µm, 0.5µm, 0.6µm and 1.0µm
• Fab 2 - 33K, 8" wafers per month 0.13µm and 0.18µm
• RFCMOS for 802.11, RFID, GPRS and GSM applications
• CIS for camera phones, sensor, medical applications
• NVM with CFlash, microFlash, Kilopass and NOVeA technologies
• GDS to GDS compatible to other foundries for fast transfers
• Shuttle Services every 6 weeks

Micrel www.micrel.com provides a unique wafer fabrication capability covering many technology nodes including:

• CMOS
• BiCMOS
• BCD
• SiGe

These processes are primarily for Commercial, Military and Advance Product Development customers and applications.

The facility houses a 16,000 square foot Class 1/Class 10 clean room, and a state of the art 200mm equipment set with advanced lithography capabilities ranging down to 65nm.

SVTC offers start-up and established companies the opportunity to develop and characterize their silicon-based technologies rapidly and cost-effectively through its shared fab environment. SVTC’s SPC controlled facility and its Development Engineering staff bridges the “lab to fab” to realize manufacturing solutions for breakthrough Silicon, MEM’s and Biotech products.  Projects are sped to completion through customer residency at SVTC, direct customer access to the fab, and use of the Process Library containing over 500 manufacturing proven recipes.

SVTC’s facility is a commercially driven, quality minded R&D environment that allows its customers’ engineering talent to take control of their own destiny.

Tower Semiconductor www.towersemi.com provides design services to bridge your success in bringing your design into Tower’s CMOS foundry which offers technology from 0.13 micron to 1.0 micron.

• Specialties in RFCMOS, Mixed Signal, Embedded NVM, CIS and Digital CMOS
• Specification to GDS
• RTL to GDS
• GDS to GDS Fab Transfer
• Full turnkey including test and assembly
• Extensive experience in development of Spice Models, Runsets for Cadence, Synopsys and Mentor, technology files for the processes
• Developed IP including standard cells, memory compilers, IO families, Embedded NVM families and CIS pixels
• Complete reference flows for both Cadence and Synopsys

Axiom Design Automation www.axiom-da.com is the leading pioneer behind developing advanced functional verification products. The company’s mission is to help customers in early and predictable verification closure and improve the overall productivity of the design verification teams.

• AXIOM offers a range of integrated functional verification products that leverage multi-CPU technology to significantly improve performance, capacity and debugging of the logic verification process. The products address all the factors involved in an integrated verification environment including performance, productivity, testbench automation and verification closure.
• AXIOM also offers consulting services in complex ASIC/SoC design and verification to a number of leading design houses, helping them achieve their design and verification targets through its unique blend of innovative tools and technologies. AXIOM works with customers on turn-key and milestone based models to take the project from chip specification to net list.

RFIC Solutions www.rficsolutions.com is a design services company focused on wireless solutions for WiFi, WLAN, WiMAX, Ultra wideband and other wireless communication markets and provides:

• RF IC design services for MMIC and RFICs using CMOS, BiCMOS, Si, SiGe, InP, InGaP/GaAs and other Processes
• RF IC products (LNAs, Mixers, Switches, PAs, etc)
• RF Module, Board & System Design services

ESEMI www.esemi.com provides state of the art modeling and simulation software tools.  ACADEMI2D - Modeling and circuit simulation program for the Windows platform.  This product allows you to create complex semiconductor devuce geometries in minutes and build sophisticated circuit models with a minimum of effort in a powerful, yet easy to use TCAD environment.

• Device Modeling:
  • Technology CAD modeling of complex semiconductor device geometries
  • Material library includes Silicon, Oxide, Air, GaAs, AlAs, InP, GaP, InAs, AlGaAs, InAlAs, InGaAsP and SiC
  • Models for Temperature, high and low fields, surface mobility, SRH, auger and direct recombination, band gap narrowing
  • Fast triangular mesh generation and mesh refinement tools
  • Import Device models from other TCAD formats
• Circuit Simulation:
  • DC and transient simulation modes
  • Full electro-thermal modeling capabilities
  • Standard library of electronic components including compact device models for MOSFET, NPN, PNP, Thyristor, NPTIGBT, PTIGBT and PIN
  • Flexible solver controls for linear solver, search parameters, back tracking decoupled parameters, equation parameters and time stepping

The software is primarily designed for use by TCAD 'device' engineers who design devices for power applications, i.e. chips required to work under high voltage/current conditions such as power MOSFETs.

ARC International (LSE:ARK) www.arc.com licenses multimedia subsystems and CPU/DSP processors that are based on industry leading, patented configurable technology, and provide system-on-chip (SoC) developers with a strategic competitive advantage.  Using ARC's subsystems and cores, licensees can develop highly differentiated ARC-based^TM chips that consume less power, are less expensive to produce and provide protection from cloning - distinct advantages over non-configurable, "fixed architecture" solutions.

• ARC Video Family: Standard Definition, programmable, multi-standard Video encode/decode subsystems targeted at flexible, high quality video processing at very low power consumption.
• ARC Sound Family: Programmable, multi standard Audio encode, decode, and post processing subsystems targeted at low power handheld audio applications, as well as companion audio to video applications.
• ARC 700 Configurable Processor Family: High performance, Linux capable RISC processors with optional DSP extensionsn and customer defined processor extension capability.
• ARC 600 Configurable Processor Family: Low Power optimized RISC processors with optional DSP extensions and customer defined extension capability. 

• FTTX/Access: BiDis, BPON/GPON/GEPON Transceivers/Triplexers, Splitters, Athermal AWGs, PLC Triplexers, etc.
• Telecom: ROADM, AWG, VMUX, VOA, DCE, Athermal AWG, Cyclic AWG, SFP/XFP Transceivers, EDFA, etc.
• Datacom: SFF, SFP, XFP, 10G LX4, CWDM/DWDM SFP, etc.
• CATV:Video receiver, EDFA, Video Combiner, Amplified Video Combiner etc.

Zarlink www.zarlink.com provides network semiconductor solutions for voice, enterprise, broadband and wireless communications. Products include PLLs, TDM switches, Ethernet switches, Optoelectronics and CESoP solutions.

• PLLs – Analog and Digital PLLs; Stratum 3 and 3E
• TDM switches from 256 x 256 to 16,384 X 16,384 channels; rate conversion; integrated DPLLs
• CESoP – Transmission of Traffic, Timing & Signaling of TDM-based connections across a managed Packet Switched Network from 4 to 32 T1/E1
• PFOMs - Parallel Fiber Optic Transceivers from (4 + 4) x 3.125, (4+4) x 2.17, 12 x 2.7 to 12 x 1.6 Gpbs
• Ethernet Switches – Managed and Un-Managed Switches, 8 to 24 port