Description

Product Development Competencies:

• Lithography (tracks, stepper, and mask aligners)
• Metal Deposition (sputter, e beam evaporation)
• Plasma Etching (DRIE and RIE)
• Dielectric Deposition (PECVD and furnaces)
• Wet Etching (metals, dielectrics, silicon – isotropic and anisotropic)
• Electroplating (Au and AuSn)
• Substrate Bonding (fusion, eutectic, anodic)
• Assembly – Dicing, die attach, flip chip bonding, wire bond, high vacuum sealing
• Characterization – probe stations to interferometres to failure analysis (SEMs to augers)

• Fab 1 - 16K, 6"wafers per month 0.35µm, 0.5µm, 0.6µm and 1.0µm
• Fab 2 - 33K, 8" wafers per month 0.13µm and 0.18µm
• RFCMOS for 802.11, RFID, GPRS and GSM applications
• CIS for camera phones, sensor, medical applications
• NVM with CFlash, microFlash, Kilopass and NOVeA technologies
• GDS to GDS compatible to other foundries for fast transfers
• Shuttle Services every 6 weeks

Tower Semiconductor www.towersemi.com provides design services to bridge your success in bringing your design into Tower’s CMOS foundry which offers technology from 0.13 micron to 1.0 micron.

• Specialties in RFCMOS, Mixed Signal, Embedded NVM, CIS and Digital CMOS
• Specification to GDS
• RTL to GDS
• GDS to GDS Fab Transfer
• Full turnkey including test and assembly
• Extensive experience in development of Spice Models, Runsets for Cadence, Synopsys and Mentor, technology files for the processes
• Developed IP including standard cells, memory compilers, IO families, Embedded NVM families and CIS pixels
• Complete reference flows for both Cadence and Synopsys

Process Relations www.process-relations.com is a software company offering software solutions and related consulting services in the area of manufacturing process development. The offered software solutions address customers performing semiconductor process development and developments of other silicon and non-silicon based thin film processes.

To support your development needs Process Relations delivers the easy to use, unique, world class Process Development Execution System XperiDesk. And our engineers help you to get XperiDesk up and running adapted to your environment.

XperiDesk enables you to:
(1) optimally use your existing knowledge,
(2) efficiently use your simulation capabilities,
(3) effectively create knowledge with a minimal number of new experiments,
(4) comprehensively document, protect and transfer to their customers the results of these developments and therefore
(5) complete your developments faster and more cost-effective.

RFIC Solutions www.rficsolutions.com is a design services company focused on wireless solutions for WiFi, WLAN, WiMAX, Ultra wideband and other wireless communication markets and provides:

• RF IC design services for MMIC and RFICs using CMOS, BiCMOS, Si, SiGe, InP, InGaP/GaAs and other Processes
• RF IC products (LNAs, Mixers, Switches, PAs, etc)
• RF Module, Board & System Design services

ESEMI www.esemi.com provides state of the art modeling and simulation software tools.  ACADEMI2D - Modeling and circuit simulation program for the Windows platform.  This product allows you to create complex semiconductor devuce geometries in minutes and build sophisticated circuit models with a minimum of effort in a powerful, yet easy to use TCAD environment.

• Device Modeling:
  • Technology CAD modeling of complex semiconductor device geometries
  • Material library includes Silicon, Oxide, Air, GaAs, AlAs, InP, GaP, InAs, AlGaAs, InAlAs, InGaAsP and SiC
  • Models for Temperature, high and low fields, surface mobility, SRH, auger and direct recombination, band gap narrowing
  • Fast triangular mesh generation and mesh refinement tools
  • Import Device models from other TCAD formats
• Circuit Simulation:
  • DC and transient simulation modes
  • Full electro-thermal modeling capabilities
  • Standard library of electronic components including compact device models for MOSFET, NPN, PNP, Thyristor, NPTIGBT, PTIGBT and PIN
  • Flexible solver controls for linear solver, search parameters, back tracking decoupled parameters, equation parameters and time stepping

The software is primarily designed for use by TCAD 'device' engineers who design devices for power applications, i.e. chips required to work under high voltage/current conditions such as power MOSFETs.

ARC International (LSE:ARK) www.arc.com licenses multimedia subsystems and CPU/DSP processors that are based on industry leading, patented configurable technology, and provide system-on-chip (SoC) developers with a strategic competitive advantage.  Using ARC's subsystems and cores, licensees can develop highly differentiated ARC-based^TM chips that consume less power, are less expensive to produce and provide protection from cloning - distinct advantages over non-configurable, "fixed architecture" solutions.

• ARC Video Family: Standard Definition, programmable, multi-standard Video encode/decode subsystems targeted at flexible, high quality video processing at very low power consumption.
• ARC Sound Family: Programmable, multi standard Audio encode, decode, and post processing subsystems targeted at low power handheld audio applications, as well as companion audio to video applications.
• ARC 700 Configurable Processor Family: High performance, Linux capable RISC processors with optional DSP extensionsn and customer defined processor extension capability.
• ARC 600 Configurable Processor Family: Low Power optimized RISC processors with optional DSP extensions and customer defined extension capability. 

Zarlink www.zarlink.com provides network semiconductor solutions for voice, enterprise, broadband and wireless communications. Products include PLLs, TDM switches, Ethernet switches, Optoelectronics and CESoP solutions.

• PLLs – Analog and Digital PLLs; Stratum 3 and 3E
• TDM switches from 256 x 256 to 16,384 X 16,384 channels; rate conversion; integrated DPLLs
• CESoP – Transmission of Traffic, Timing & Signaling of TDM-based connections across a managed Packet Switched Network from 4 to 32 T1/E1
• PFOMs - Parallel Fiber Optic Transceivers from (4 + 4) x 3.125, (4+4) x 2.17, 12 x 2.7 to 12 x 1.6 Gpbs
• Ethernet Switches – Managed and Un-Managed Switches, 8 to 24 port